Due to the faster heating rate in this zone, the temperature difference between the components in the latter part of the temperature zone is relatively significant. If the temperature rises too fast, thermal shock will occur, and the PCB and components are easily damaged if the temperature rises too slowly, the flux activity will affect the welding quality. The Preheating Zone: The function of this zone is to heat the PCB at room temperature as soon as possible to reach the second set goal, but the heating rate should be controlled within an appropriate range. Therefore, good optimization of the reflow temperature curve can achieve better SMT placement quality.ġ. These defects can be avoided by improving the reflow profile. SMT defects caused by improper reflow soldering curve include component burst/crack, component warpage, bridging, virtual soldering, PCB delamination or blistering, etc. The curve of the solder joint temperature between the printed circuit board and the surface mount component overtime must meet specific control requirements. The process control of reflow soldering is manifested as the control of the reflow curve in the process. Therefore, reflow soldering process control is the key to SMT quality control.
#REFLOW SOLDER PASTE FULL#
If there is no reasonable and feasible reflow soldering process control, the full process control will become meaningless. The quality control of the reflow soldering process determines the quality of the terminals produced by SMT because defects caused by the design of surface mount components and printed circuit boards, solder paste printing, and component placement will eventually be concentrated in the reflow soldering process. The most critical process in SMT technology is the reflow soldering process. SMT technology meets the needs of the modern electronics industry and occupies a leading position in the production of the modern electronics industry. It can achieve a higher assembly density of electronic components per unit area of printed circuit boards. SMT technology has the advantages of high production efficiency and good electrical interconnection performance. SMT is the mainstream of secondary packaging in microelectronics technology, gradually replacing the early through-hole assembly in PCB assembly.
#REFLOW SOLDER PASTE SERIES#
SMT (Surface Mount Technology) is a series of comprehensive engineering technologies involving microelectronics, precision machinery and instruments, automatic control, welding, and material inspection.
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